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We design the hardware, bring up the board, write the firmware and carry it through design-for-manufacture, test and qualification into high-volume production. Real electronics work, from a blank schematic to a line that yields, with the discipline a regulated product demands.
A prototype on the bench is the easy part. The value is in a board that passes test, survives the field and yields on a real production line at volume.
First pass*
the bring-up and test outcome we design toward, not the third respin.
DFM*
design-for-manufacture baked in from the schematic, not bolted on later.
IPC-A-610*
the acceptance standard our boards are built and inspected to.
Reflecting how we approach hardware, firmware and tech-transfer to high-volume manufacturing.
From the first schematic to a qualified product on a production line, with the firmware and test coverage that make it real.
Circuit design, component selection and multilayer PCB layout with signal integrity, power and EMC considered from the first schematic, not after the first respin.
We power up new boards, characterize them on the bench and drive them to a stable, measured baseline, closing the loop between design intent and real silicon.
Bootloaders, drivers and application firmware on bare metal, RTOS or embedded Linux, with secure boot and signed updates where the product demands them.
DFM and DFT reviews, test-point strategy, boundary scan and functional test fixtures, so the design is built to yield and every unit is provably good.
EMC, environmental and reliability testing planned early, with RoHS and REACH compliance and the evidence a regulated product needs to pass.
A clean handover to the factory: documented BOM, test procedures, first-article support and yield ramp, carrying the product from prototype to high-volume production.
A manufacturing-led path from a hardware requirement to a product that yields on a real line.
Turn the product need into an electrical architecture, a component strategy and a test plan, with cost, supply and manufacturability weighed from the start.
Schematic capture, PCB layout and a working prototype, with firmware brought up in parallel so hardware and software prove each other out.
Bench characterization, EMC and environmental testing and design-for-test refinement, driving toward first-pass bring-up and a qualified baseline.
Release a documented BOM, test fixtures and procedures to the factory, support first-article builds and hold the design steady as volume ramps.
Turn the product need into an electrical architecture, a component strategy and a test plan, with cost, supply and manufacturability weighed from the start.
Schematic capture, PCB layout and a working prototype, with firmware brought up in parallel so hardware and software prove each other out.
Bench characterization, EMC and environmental testing and design-for-test refinement, driving toward first-pass bring-up and a qualified baseline.
Release a documented BOM, test fixtures and procedures to the factory, support first-article builds and hold the design steady as volume ramps.
Hardware, firmware and edge systems we have designed, brought up and shipped in demanding environments. Client names withheld under NDA.
How we designed and shipped a world-first LoRa-based wearable that monitors worker vitals, detects falls, and locates people inside hazardous facilities, from silicon to volume manufacturing.
7,000+
Frontline workers protected
12 mo
From concept to volume production
A hardened medical IoT gateway with secure boot, a custom Yocto Linux build, and Azure IoT integration, engineered for end-to-end security and compliance.
Read the case study EmbeddedA gateway that brings devices on the DDS protocol, traditionally offline, onto Azure IoT Hub while preserving identity, rolling certificates, and staying compliant.
Read the case studyStandards and experience
Hardware that ships is not a matter of taste. We design to recognized electronics and quality standards, and we back it with real board, firmware and tech-transfer delivery.
Our experience
Hardware design, board bring-up, secure-boot firmware and volume tech-transfer delivered across medical, industrial and safety-critical products.
designed to
IPC-A-610
Assembly acceptance
Acceptability criteria for electronic assemblies, the standard boards are built and inspected to.
ISO 9001
Quality management
Quality management system underpinning our design and manufacturing process.
RoHS / REACH
Materials compliance
Restriction of hazardous substances and chemical safety for products placed on the market.
JEDEC
Semiconductor standards
Component, packaging and reliability standards for semiconductor devices and assemblies.
The result is hardware that is manufacturable, compliant and reliable, and that yields on a real production line.
Capabilities
Product Engineering
AI, Data & Intelligent Systems
UX & Product Design
Experience Engineering
Cybersecurity
Compliance Engineering
US · Muscat · Bangalore · Puttur, ISO 13485:2016 · ISO 27001:2022 · ISO 9001:2015
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